3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility : Advanced Stacking and Planar Solutions for 5G Mobility. IEEE Press
(2018)

Nonfiction

eBook

Provider: hoopla

Details

PUBLISHED
[United States] : Wiley, 2018
Made available through hoopla
DESCRIPTION

1 online resource

ISBN/ISSN
9781119289661 MWT18087253, 1119289661 18087253
LANGUAGE
English
NOTES

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments - Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility - Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab - Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail - Provides chapter-wise review questions and powerpoint slides as teaching tools

Mode of access: World Wide Web

Additional Credits